§ 250.144.


When bonds are to be issued pursuant to Subdivisions 5, 6, or 7 of Subarticle VI, pursuant to a similar plan, in which the bonds do not represent fixed amounts which are a lien on the properties assessed, or when a maintenance district is formed, no action, suit or proceeding to set aside, cancel or void the jurisdiction of the Board in the proceedings or to order the issuance of the bonds or to issue the bonds, or to levy any annual assessment to pay the principal and interest of the bonds, or maintenance of said improvements, unless such suit, action or proceeding shall have been commenced within 30 days after the Board shall have ordered the acquisitions and improvements or formation of said district.


(Added by Ord. 225-81, App. 5/5/81)


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